Abstract
Flip chip on board (FCOB) solder joint reliability under thermal shock stress was investigated. With underfill materials, the solder joint lifetime was increased from 37 to 1,300/2,480 cycles depending on the particular underfill material used. Through the use of CSAM, SEM, dye penetration tests and cross sectioning, the reliability of a FCOB assembly under thermal shock stress was evaluated. Both dye penetration and SEM fracture analysis can be used to measure quantitatively the extent of crack propagation for assemblies without underfill. A new failure mechanism, PCB cracking was also observed and discussed.
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