Abstract
Finite element stress analysis was carried out to study the residual bending stresses in a Flip Chip On Board (FCOB) package assembly during the underfill encapsulation curing process. Out-of-plane warpage is generated in the package resulting from mismatches in the coefficients of thermal expansion (CTE) of the various materials in the assembly. In this paper, finite element analyses were conducted on 2-D plane-strain and 3-D models of the FCOB assembly to investigate the development of curing-induced bending stresses in the silicon die for a FCOB package. The FEA results for the die bending stresses were correlated to simple beam and plate bending theory with reasonable accuracy. Further FEA studies were conducted on the effect of underfill encapsulant material properties on the solder joint shear stresses. Elasto-plastic and creep analysis of the solder joints in the FCOB package subjected to a liquid-to-liquid thermal shock test condition provided useful data on the solder joint stress and strain response.
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