Abstract
The modification of transparent materials is enabled by focused ultrashort laser pulses. Single pass processing up to several millimeters can be achieved by the usage of elongated beam profiles. We studied the mechanical separability in dependence of the material thickness. As simulations show, asymmetric beam profiles can cause modifications with preferential direction reducing the necessary breaking force. Pump-probe microscopy is implemented to examine the laser-matter-interaction. We present a measured 3D-reconstruction of the transient interaction inside the material and elucidate the desired crack formation. We demonstrate beam shaping concepts to create a new, efficient and robust class of Bessel-like beams, which can be used to achieve a preferred crack direction. We verify the concept by modification and separation of silicate glasses.
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