Abstract
Abstract Low temperature nanojoining and high temperature service in the microelectronic packaging technology has received much focused attention. Here, we suggest a facile thermal decomposition method for preparation of Cu10Sn3 nanoparticles (NPs) with high bulk melting point (640 °C) by using common organic salts, oleylamine (OLA), and oleic acid (OA). The uniform and dense sintered Cu/Cu10Sn3/Cu joints can obtain at 300 °C, 10 MPa, 20 min, which presents the average shear strength of 25.1 MPa. In addition, the interdiffusion of Sn and Cu atoms at interface between the sintered Cu10Sn3 layer and Cu makes the interface a metallurgical bonding. This sintered Cu/Cu10Sn3/Cu joints can provide a new interconnect material and technology for high-power device package.
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