Abstract

We used the inkjet printing to fabricate alumina–resin hybrid films without a high temperature sintering process. Single- and co-solvent ink systems showing different evaporation behaviors were formulated in order to understand their impacts on the inkjet-printing of the alumina dots, lines, and films. The packing densities of the inkjet-printed alumina films from both ink systems were around 60% which is higher than the value obtained by other conventional methods. Since the high temperature sintering process was avoided, the polymer–resin was infiltrated through the inkjet-printed alumina films by the same inkjet printing as a binder. The microstructures of these hybrid films were investigated in order to confirm if the microvoids in the films were filled with the resin. The dielectric properties of these hybrid films such as relative permittivity and Q-value were measured in order to assess if these hybrid materials is applicable to three-dimensional (3D) system integration as ceramic package substrates.

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