Abstract
We used the inkjet printing method to fabricate alumina-resin hybrid films without a high temperature sintering process. The dielectric properties of the alumina-resin hybrid films were studied in order to assess if the alumina-resin hybrid films are applicable to the electronic package substrates. Various numerical models were introduced to understand the relative permittivity of the alumina-resin hybrid films. Q-values of the alumina-resin hybrid films are also measured and compared to the commercially available substrate materials. The impact of microvoids on the Q-value of the inkjet-printed alumina-resin hybrid films was also studied. The microstructures of the inkjet-printed hybrid materials were investigated in order to confirm if the microvoids in the films were filled with the resin.
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