Abstract

International Journal of Computational Engineering ScienceVol. 04, No. 03, pp. 581-584 (2003) Poster PapersNo AccessFABRICATION OF AMORPHOUS CARBON MICRO-MEMBRANES BY DEEP REACTIVE ION ETCHING TECHNIQUELIUJIANG YU, B. K. TAY, D. SHEEJA, Y. Q. FU, and J. M. MIAOLIUJIANG YUIon Beam Processing Laboratory, Block S1, School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore 639798, Singapore Search for more papers by this author , B. K. TAYIon Beam Processing Laboratory, Block S1, School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore 639798, Singapore Search for more papers by this author , D. SHEEJAIon Beam Processing Laboratory, Block S1, School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore 639798, Singapore Search for more papers by this author , Y. Q. FUSchool of Mechanical and Production Engineering, NTU, Singapore - 639798, Singapore Search for more papers by this author , and J. M. MIAOSchool of Mechanical and Production Engineering, NTU, Singapore - 639798, Singapore Search for more papers by this author https://doi.org/10.1142/S1465876303001800Cited by:1 PreviousNext AboutSectionsPDF/EPUB ToolsAdd to favoritesDownload CitationsTrack CitationsRecommend to Library ShareShare onFacebookTwitterLinked InRedditEmail AbstractThe primary problem of large intrinsic compressive stress induced during the deposition of amorphous carbon (a-C) films prepared by Filtered Cathodic Vacuum Arc (FCVA) technique has been overcome by preparing the films in conjuction with high substrate pulse biasing. However, it has been observed that the stress reduction is achieved by sacrificing the mechanical properties such as hardness and Young's modulus of the films. Hence the mechanical properties of the films were studied as a function of substrate bias voltage. In addition, to demostrate these low stress films, one-micron thick, a-C membranes were fabricated by photolithography technique together with deep reactive ion etching (deep RIE) and wet KOH etching.Keywords:a-C filmssubstrate biasMEMSmicro-membranes References X. Shiet al., J. of Appl. Phys. 79, 7234 (1996). Google ScholarX. Shi, L. K. Cheah and B. K. Tay, Thin Solid Film 312, 160 (1998). Google ScholarB. K. Tayet al., Surf. Coat. Technol. 105, 155 (1998). Crossref, Google ScholarG. M. Pharret al., Appl. Phys. Lett. 68, 779 (1996). Crossref, Google Scholar B.K. Tay, D. Sheeja and L.J. Yu, Diamond and Related Materials, in press . Google Scholar Andr'e Anders , Handbook of Plasma Immersion Ion Implantation and Deposition ( John Wiley & Sons , 2000 ) . Google Scholar FiguresReferencesRelatedDetailsCited By 1Diamond-like carbon for MEMSErwin Peiner, Arti Tibrewala, Ralf Bandorf, Holger Lüthje and Lutz Doering et al.26 June 2007 | Journal of Micromechanics and Microengineering, Vol. 17, No. 7 Recommended Vol. 04, No. 03 Metrics History Keywordsa-C filmssubstrate biasMEMSmicro-membranesPDF download

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