Abstract
Lead-free solder is widely used in the industry, especially in wave soldering. However, the stainless steel holders used in wave soldering are prone to corrosion by the lead-free solder due to increased reactive wetting. Besides, owing to the high affinity between the holders and solder, they are often used to take solder out of the container. To improve tin repellence and the mechanical properties of the stainless steel holders, Ti/TiC and Ti/TiC/DLC coatings are deposited by filtered cathodic vacuum arc (FCVA) and plasma immersion ion implantation and deposition (PIII&D). The morphology, structure, composition, microhardness, wear resistance, electrochemical properties, and wetting characteristics are investigated systematically. The DLC coating, which has an amorphous structure and ID/IG ratio of about 0.55, further enhances the frictional properties, corrosion resistance, and hydrophobic characteristics of the Ti/TiC structure. The surface-modified holders show excellent tin repellence in wave soldering.
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