Fabrication of AD/DA microfluidic converter using deep reactive ion etching of silicon and low temperature wafer bonding

Abstract

The purpose of this work is to describe an original process that has been designed for the fabrication of a microfluidic converter. The fabrication is based on deep reactive ion etching of silicon and low temperature full wafer adhesive bonding. The technology development includes an improvement of the bonding process in order to produce an adaptive strength of SU-8 bond which not only ensures absence of debonding failures during the silicon deep etching procedure and the subsequent dicing procedure, but also avoids the potential SU-8 overflow leakage into channels due to the bonding step. Besides, the originality of the work is not only in the process but also in the design of the device. Common actuation method for microfluidic system is either based on closed-channel continuous-flow microfluidic (CMF) or droplet-based microfluidic (DMF). Both of them have advantages and disadvantages, and their integration on a single system is in dire need. In this paper, we briefly discuss the concept of microfluidic converter, integrating CMF with DMF, which can: (i) continuously preload reagents, (ii) independently manipulate several droplets, (iii) recombine and export samples into closed-channel continuous flow, making it ideal for interfacing to liquid-handling instruments and micro-analytical instruments.