Abstract
The potential of HfO2 as a memory semiconductor material with ferroelectric properties in thin-film deposition has been recently analyzed. In this study, the preparation, composition, and physical properties of Al-doped hafnium oxides were analyzed. HfxAl(1-x)Oy (HAO) [x = 0.33, 0.5, and 0.67] powders were prepared by controlling the ratio of Hf to Al and using ball milling. The HAO powder was calcined at 1000 °C in a furnace and then sintered in a temperature range of 1000–1600 °C by a solid-state reaction method to fabricate high-quality targets with high densities. The density and crystal size increased with the sintering temperature. The 1600-°C Hf0.67Al0.33Oy target was optimal for thin-film deposition. In addition, the target properties were affected by an increase in the HfO2 content x. The crystal structures and sizes, surface free energies, contact angles, and band gaps of the HAOs were evaluated to analyze their potential as high-k dielectric materials. HAO is a promising high-k dielectric and memory material, valuable for further studies on ferroelectric gate oxide materials. This study contributes to the increasing number of studies on the ferroelectricity of HfO2 thin films and provides a fundamental understanding of this material and its potential for novel device applications.
Published Version
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