Abstract
The development of 5G technology has put forward new requirements for computing the abilities of chips, and chip power has also significantly increased. Consequently, the heat load of the rack will increase rapidly in the future. Traditional computer room air conditioning (CRAC) systems cannot satisfy the rack’s high heat flux dissipation requirements, and new cooling forms such as chip-level cooling should be adopted. In this study, a two-stage chip-level cooling system, which is pumpless and waterless, offers flexible and detachable installation based on practical requirements, was proposed. The cooling system removes heat from the chips to the outdoors via two thermosiphon loops, where the heat is first transferred to cold plates tightly attached to the chip surfaces, then transferred through heat exchangers attached to the rack side, and finally dissipated outdoors through air cooling. In this study, a two-stage chip-cooling system was constructed and tested in an enthalpy-difference laboratory. The effects of the liquid filling ratio on the thermal resistance, total temperature difference, and fluid flow pattern under different heat loads were investigated. Second, a heat transfer model for analysing thermal resistance networks was constructed, and the proportions of different types of thermal resistance were determined. Third, an energy-saving analysis of the system is established. The experimental results showed that at single chip heat load 200 W and total heat load 2 kW, the heat transfer temperature difference between chips and outdoors is less than 20 °C at extremely high energy efficiency (cooling load factor reaches 0.05 at outdoor temperature 40 °C), which makes it feasible for free cooling throughout the year in most Chinese areas. The annual PUE in Beijing using the proposed system is 1.15, which indicates a 30 % reduction of the total energy consumption of data centres.
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