Experimental investigation on thermal performance of plate fin heat sinks with nano PCM

Abstract

In this study, electronic devices are experimentally examined to improve the thermal performance of the plate fin heat sink. It is performed on the basis of the paraffin wax used as a phase change material (PCM) filled in a heat sink plate. The aim of the study is to select the most efficient SiO2 volume fraction in paraffin wax to be filled in a heat sink with a plate finish. The SiO2 is considered to be a nano-particle and 1%, 3%, and 5% of SiO2 volume is selected for the preparation of nanoPCM. At the base of the plate fin heat sink, a constant heat source is applied. A plate fin heat sink is selected to quantify the effect of nanoPCM as a reference heat sink. The effect of thermal performance of heat sinks was examined using a different volume fraction of nanoPCM. The thermal performance comparison is carried out with and without PCM for the plate heat sink of Reynolds number 4000- 16000. In order to find the effect of PCM and variable Reynolds number, the investigation of the plate fin heat sink is examined. The results showed that the inclusion of PCM (paraffin wax and SiO2-based nanoPCM) in the heat sink plate provides better cooling performance and keeps the desired temperature. The results show that the heat sink based on PCM enriched with nanoparticles provided better thermal performance compared to the heat sink with a simple PCM. The thermal performance of the SiO2 based nanoPCM 3% volume fraction is better than 1% volume fraction and the heat sinks of the plate finish.