Abstract
Copper (Cu) is a toxic pollutant and its presence in wastewater, even at low concentrations, can have a significant environmental impact. In this work, a method for the determination of Cu was developed using a voltammetric technique involving a platinum electrode in citrate medium. Cu at a ppb level was determined by both chronoamperometry (CA) and anodic linear scanning voltammetry (ALSV), and the results were compared to those from inductively coupled plasma optical emission spectroscopy (ICP-OES). The results obtained were similar, having a deviation of 2.56%. The least squares method was used to evaluate the correlation between the ALSV and ICP-OES results. Statistical analyses showed a 95% confidence interval.
Highlights
Cu at a ppb level was determined by both chronoamperometry (CA) and anodic linear scanning voltammetry (ALSV), and the results were compared to those from inductively coupled plasma optical emission spectroscopy (ICP-OES)
The least squares method was used to evaluate the correlation between the ALSV and ICP-OES results
Copper (Cu) and copper‐based alloys are used in a variety of applications that are necessary for a reasonable standard of living [1]
Summary
Copper (Cu) and copper‐based alloys are used in a variety of applications that are necessary for a reasonable standard of living [1]. Cu is one of the most investigated metallic catalysts, mainly due to its industrial importance [1, 2]. Industries, such as metallurgy, mining, and electronics, generate Cu as an effluent. Cu electrodeposition has been widely used as an aluminum replacement in the connector industry [1, 7]. It plays a key role in the electronics industry, especially in the manufacturing of printed and interconnected circuits, fabrication of microelectronic devices, and nanotechnology applications [8, 9]. Organic additives are commonly used in the acidic baths of copper sulfate electrodeposition to improve the quality of the deposits, including physical and mechanical properties such as gloss, hardness, smoothness, and ductility [10-12]
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