Abstract
Ceramic substrates with thin film and thick film conductor traces are widely used in microelectronic packages for high temperature operation. In high power applications where the maximum current in the package may be hundreds of amperes, much thicker conductive traces are normally required. For such applications, Direct Bonded Copper (DBC), Direct Bonded Aluminum (DBA) or Active Metal Bonded (AMB) substrates are good candidates. These substrates provide low electrical resistance and high ampacity, thereby enable the design of high power circuits for high temperature operation. The most commonly observed failure mode in these substrates is the delamination of metal layer from the ceramic. The lifetime of a ceramic substrate can be significantly reduced by the processing conditions such as maximum process temperature, and the process gases that the substrates are exposed to. It has also been shown that the propagation of cracks in the ceramic can be abated by dimpling the metal layers along edges and corners. In order to evaluate the effectiveness of these types of substrates for power applications, substrates with various combinations of metal thicknesses and ceramic composition (Al2O3 and AlN) were evaluated for delamination as a function of thermal shock cycles. These samples included both dimpled and non-dimpled metallization. The samples were thermally cycled between −40 °C and 200 °C. A few of these substrates were exposed to forming gas at 340 °C prior to thermal cycling to imitate process conditions. Sample randomization was performed to provide statistically significant data. After a certain number of thermal cycles, delamination cracks were observed to nucleate and propagate in the substrates. Data regarding the reliability of these substrates as a function of thermal shock cycles is presented in this paper, along with failure mechanisms that are commonly observed. Computer simulations were performed to understand the conditions that lead to delamination cracks, and to estimate the crack growth rates in these substrates.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
