Abstract
This paper presents a study of ZTC point (Zero Temperature Coefficient) in SOI MOSFETs devices, partially (PD-SOI) and fully (FD-SOI) depleted mode. The study is performed from a simple analytical model proposed for the determination of the gate bias voltage at ZTC point (VZTC) using the first-order models of the drain current (IDS) characteristics as a function of the gate voltage (VGF), operating in the linear and saturation regimes. To validate the model proposed results were compared with experimental data, and the analytical predictions are in very close agreement with experimental results in spite of the simplification used for the VZTC model proposed. Analysis was performed to study the impact on the VZTC value with the change in the parameters used as reference, such as Naf and toxf.. The maximum error observed for the PD devices is 3.1% and 4.6% in the linear region and 3.5% and 7.2% in the saturation region, respectively. For FD devices the maximum error observed was 11% and 10% operating in the linear and 5.3% and 8.4% in the saturation regime. In order to verify the stability of the ZTC point as a function of the mobility degradation (c), channel length (L) and drain voltage (VDS), the proposed model was applied to the devices mentioned above. The VZTC changes in the temperature range investigated showed a temperature mobility degradation dependence and are more pronounced in PD devices. The VZTC voltage for nMOS devices presented a lower value operating in the saturation region than in the linear region, and this difference becomes more pronounced to devices with smaller channel length for both devices, n and pMOS. Analyzing the VZTC variation with drain voltage (VDS), showed a decrease in VZTC value for higher VDS, for both studied devices. The model proposed results were evaluated using experimental data from other SOI MOSFET technologies. And also we have obtained for the GC SOI and GC-GAA-SOI technologies a very close agreement, operating in both regions, linear and saturation.
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