Abstract
This study proposes a method for the estimation of heat generation in semiconductor devices. The proposal is based on the inverse heat transfer problem, where the objective function is minimized using Levenberg-Marquardt regularization, and the forward problem is solved with the three-dimensional finite element method. The inverse problem is divided into two types of analyses. The first is a procedure named calibration, which is the inverse heat transfer problem for material properties and boundary condition estimation, and the second is the inverse problem for heat source estimation. The experimental subjects are a ball-grid-array (i.e., BGA), quad-flat-no-leads (i.e., QFN) and a heat-sink-small-outline package (i.e., HSOP). As a first step, the calibration procedure to estimate the heat capacity and thermal conductivity of a heater is carried. Said heater is used to provide a source term for the calibration of the experimental subjects. By placing the heater on the top surface of the mold, the unknown material properties and boundary conditions of each package are determined. After model calibration, the heat generation in each respective die is successfully estimated via inverse analysis, with a maximum error of 10% relative to the HSOP.
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