Abstract
The continuous demand for faster and further data transfer with power efficiency drives innovation in the datacenter, as cloud computing, optical networks, and high-performance computing relies more and more on optics to support the bandwidth challenge. As the nanometer size transistors get closer to the physical limit, the data processing involved in the future applications needs to interface with optical interconnects. Silicon photonics enable light manipulation and processing inside the chips and is a key enabler for optics integrated system at high level of performance over a traditional CMOS-based technology. GLOBALFOUNDRIES has developed a CMOS/silicon photonics platform in an advanced 300mm fab that includes the monolithic integration of RF, digital elements, and silicon photonics features inside a single chip. Packaging features are a critical element of this offering, and this presentation will discuss the 2022 view of these advanced features and what it will take for establishing an ecosystem of packaging partners for customers to utilize these leading-edge features for their system needs.
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