Abstract
Erratum to “Chemical bonding structure in porous SiOC films (k < 2.4) with high plasma-induced damage resistance” [Micro and Nano Engineering Vol. 3 (2019) 1–6
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
