Environmental stability of candidate dielectrics for GaN-based device applications

Abstract

The thermal and chemical stability of potential dielectrics for GaN-based devices in a GaN metal organic chemical vapor deposition (MOCVD) environment is investigated, and their suitability for use as a gate dielectric and as a regrowth mask for the selective area growth of GaN is discussed. Thin films of MgO, Sc2O3, and Sc2O3/MgO were grown by molecular beam epitaxy on GaN/sapphire substrates and then annealed in a MOCVD reactor under GaN growth conditions except for the lack of trimethylgallium. All films were processed into metal-oxide-semiconductor diodes and were characterized before and after being annealed using atomic force microscopy, x-ray reflectivity, x-ray photoelectron spectroscopy, current-voltage (I-V), and capacitance-voltage (C-V) measurements. The Gibbs free energy of all possible reactions was calculated, and their probability and possible influence on the characterization results is examined. After being annealed, the atomic force microscopy of the oxide films showed some degree of roughening for all of them. Despite the surface roughening, all the oxide films examined showed potential for use as a regrowth mask. The MOCVD anneal caused the electrical properties of the MgO film to degrade considerably, and the Sc2O3 films were unable to be electrically characterized after annealing due to shorting, which is believed to be caused by the formation of a ScN layer on the surface. The effect of the thickness of the Sc2O3 cap for MgO films was investigated. The characterization results indicate that the Sc2O3 film dissolved into MgO during annealing and that a ScN film did not form on the surface. Of all the oxide films examined in this study, the Sc2O3/MgO stack with the thinner Sc2O3 cap exhibited the greatest stability with respect to its electrical properties.