Abstract
Abstract Conformal coatings are thin polymeric layers applied on (RF)/microwave printed circuit boards, chips, dies and other electronic components to protect them from moisture and corrosion. Despite this protection, exposure to excessive humidity can cause delamination, increase dissipation factors and dielectric constants of the coating, and changing circuit switching-speed. In this paper, we will discuss dielectric performance of UVA LED-curable resin formulations with enhanced flexibility and adhesion as a new approach compared to traditional mercury UV curable conformal coatings. These advances reduce the potential for delamination, delivering greater protection of different applications, especially those for extreme environments.
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