Eliminate Costly Component Out Of Pocket Defect Condition during Microelectronic Component Packaging/Shipping/Handling

Abstract

Abstract High value devices used in microwave modules and other microelectronic assemblies have become increasingly thin and susceptible to “Component Out Of Pocket” (COOP) conditions that can occur during packaging, shipping, and customer handling. This defect condition is especially problematic for automated assembly which strives to be touch-free and efficient with orderly device presentation. COOP is a major contributor to “Cost Of Poor Quality” (COPQ) within the business. A funded study into COOP conditions was conducted and a dozen root causes were identified. It was discovered that traditional “waffle packs” have mechanical issues related to flatness tolerances with respect to the waffle tray and lid. The addition of a standard clip further contributes to the issue, both of which are key root causes of the costly “Component Out Of Pocket” (COOP) condition. A novel Lid-Clip System (LCS2) was engineered to compensate for those mechanical issues, bringing robust captivation and preservation of devices in waffle tray pockets. Static dissipative material for lid and clip was selected to provide unparalleled ESD Class 000 protection for high value devices with the lowest voltage susceptibility thresholds.