Abstract

Electropolishing (EP) is applied to niobium (Nb) superconducting radio frequency (SRF) cavities, which are used in particle accelerators for their surface treatment. The EP process for 1.3 GHz cavities has been extensively studied earlier. In this work, a parametric study on EP of low-β (0.61) 650 MHz Nb SRF cavities (LB650), which will be used in pre-production cryomodule for proton improvement plan-II (PIP-II) linear accelerator, was conducted to determine adequate EP conditions for attaining a smooth surface of the cavities. EP performed with the standard parameters and an initial cathode (cathode-I) having a cathode surface area of ∼5% of the cavity surface area yielded a rough equator surface of the cavity. The grain step height on the equator weld position was measured to be ∼32μm. The rough surface was attributed to preferential grain etching confirmed by a polarization curve showing a linear relationship between the EP current and voltage and the absence of the current plateau region. The cathode was modified to make its surface area twice that of cathode-I. The modified cathode (cathode-M) provided a current plateau region in the corresponding I-V curves measured at different cavity temperatures. The onset voltage for the plateau was found to be higher at higher cavity temperatures. This study revealed that even with cathode-M, the standard 18 V was low for EP of such large-sized cavities when the cavity temperature was ≥18 °C. EP performed at a higher voltage of 22–24.5 V with cathode-M yielded a smooth surface with a grain step height of only ∼0.6μm. The applied EP conditions also improved removal uniformity along the cavity length. In contrast to the cavity treated with cathode-I, the cavities treated with cathode-M achieved a significantly higher accelerating gradient (Eacc) in vertical tests conducted in a cryostat at 2 K. The modified EP was found efficient to produce the cavities that achieved Eacc of 22.4 MV/m, required by PIP II project in the baseline RF tests, to qualify for further surface processing used to enhance their quality factors.

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