Abstract
The effect of electromigration (EM) on Sn(Cu)/Ni/Cu solder joint interfaces under current stressing of 104 A/cm2 at 160°C was studied. In the pure Sn/Ni/Cu case, the interfacial compound layer was mainly the Cu6Sn5 compound phase, which suffered serious EM-induced dissolution, eventually resulting in serious Cu-pad consumption. In the Sn-0.7Cu case, a (Cu,Ni)6Sn5 interfacial compound layer formed at the joint interface, which showed a strong resistance to EM-induced dissolution. Thus, there was no serious consumption of the Cu pad under current stressing. In the Sn-3.0Cu case, we believe that the␣massive Cu6Sn5 phase in the solder matrix eased possible EM-induced dissolution at the interfacial compound layer due to current stressing.
Published Version
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