Abstract
The mutual interaction between Sn/Ni and Sn/Cu interfacial reactions in a Ni/Sn/Cu sandwich sample has been studied. The major interfacial reaction product on the Cu side was Cu6Sn5, while on the Ni side, a ternary (Cu,Ni)6Sn5 compound layer was formed. We found that the growth kinetics of the interfacial compound layers on both sides reached a steady state in the late reflow stage. The interfacial compound layer on the Cu side retained a constant thickness. On the other hand, the interfacial compound layer on the Ni side grew at a relatively fast rate, which was found to be linear with time. Our results indicate that the growth of the ternary (Cu,Ni)6Sn5 compound layer was controlled by the Cu dissolution flux at the solder/Cu6Sn5 compound interface. The dissolution constant of the Cu6Sn5 compound into the molten Sn was determined to be 0.13 μm/s.
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