Abstract
Wafer bonding of GaAs using an ammonium sulfide (NH4)2S treatment is investigated for various structures. The effect of the wafer offcut angle on the electrical conductivity of III-V solar cell devices using n-GaAs/n-GaAs wafer-bonded structures is studied. High resolution x-ray diffraction is used to confirm the misorientation of the bonded samples. Additionally, we compare the electrical properties of epitaxially grown p-n junctions on GaAs to n-GaAs/p-GaAs wafer-bonded structures. High resolution transmission electron microscopy (HRTEM) and scanning transmission electron microscopy (STEM) are used to compare the interface morphology across the range of relative misorientations after a 600 {degree sign}C RTP. The ratio of well-bonded crystalline regions to amorphous oxide inclusions is consistent across all bonded samples, indicating that the degree of misorientation does not affect the level of interface recrystallization at high temperatures.
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