Abstract
Abstract Copper matrix composites reinforced with 1, 3, 5, 7 vol.% Cu-coated SiC whiskers of consistent orientation (SiCw/Cu) were prepared by powder metallurgy and hot extrusion. The microstructure of composites was investigated by scanning electron microscopy. The SiC whiskers were arranged along the direction of hot extrusion and distributed uniformly. The composites were fabricated into specimens with different whisker orientations, and their electrical conductivity was tested. The effects of SiC whiskers orientation and content on the electrical conductivity of composites were investigated through experiment. Results show that the SiC whiskers content was the major factor affecting the electrical conductivity of the composites. With increasing SiC whisker orientations angel, the electrical conductivity of composites is improved. The electrical conductivity model has been established by taking into account the SiC whiskers content, whisker orientation and microstructure parameters, and the results were in good agreement with experimental data. Graphical abstract: Copper matrix composites reinforced with SiC whiskers of consistent orientation were prepared. The orientation of SiC whiskers changes from 0∘ to 90∘, resulting in electrical conductivity anisotropy of composites.
Highlights
Copper matrix composites have high strength at the room, and the electrical and thermal conductivity closeGraphical abstract: Copper matrix composites reinforced with SiC whiskers of consistent orientation were prepared
The electrical conductivity model has been established by taking into account the SiC whiskers content, whisker orientation and microstructure parameters, and the results were in good agreement with experimental data
The results show that required Cu-coated has been deposited on SiC whiskers, and without formation of Cu2O and other byproducts
Summary
Copper matrix composites have high strength at the room, and the electrical and thermal conductivity close. Ceramic particles can improve the strength while reduce the plasticity of metal matrix composites [9]; Whiskers can enhance plasticity of copper matrix composites, especially at high temperatures [10], which is beneficial to the durability-damage tolerance design of composites [11]. This is due to the fact that whisker has less defects (voids, dislocations, grain boundaries, etc.), so that their strength are close to the theoretical value of intact crystals. The results show that electrical conductivity of SiCw/Cu composites can be predicted by the model
Sign-in/Register to view highlights & summary Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
