Electrical characterization of crystal defects and oxygen in czochralski silicon using a gate-controlled diode

Abstract

Defect generation in Czochralski (CZ) silicon crystal during heat treatment and effect of the defects on generation currents, measured by gate controlled diodes, were investigated. Sample wafers were obtained from an as-grown CZ silicon ingot which has a wide range of oxygen concentration but keeps other characteristics nearly constant. In the diode fabrication process, a two-step heat treatment method was utilized to control defect generation. It was found that stacking faults and dislocation loops, whose densities depend on oxygen concentration, increase the reverse current of the diode and the reverse current increases caused by defects vary with heat treatment condition. The most noticeable result was that the reverse current is enhanced by increasing oxygen concentration, even if no defect is observed in the device active region because of low defect density induced by heat treatment or of denuded zone formation. This result suggests the existence of some kind of electrically active defect caused by oxygen atoms in the crystal. Surface generation current is independent of crystal quality and two-step heat treatment conditions.