Electrical and Mechanical Performance of Quilt Packaging with Solder Paste by Pin Transfer

Abstract

Electrical and mechanical performance of Quilt Packaging (QP), a 2D system-in-package chip-to-chip interconnection, is presented. QP employs contacts at the edges of integrated circuit dies along their vertical surfaces. Based on 3D HFSS simulations, the self-inductance of QP can be less than 0.01 nH, and the self-capacitance can be less than 0.034 pF due to the shortness of the interconnection path. QP interconnection using solder paste with pin transfer is presented, and mechanical reliability is evaluated. A new pull test system specifically designed for QP is presented. The pull force that causes failure in a set of edge interconnects totaling 3 mm width of nodules is about 658 gram-force for Sn63Pb37 and 953 gram-force for SAC305.