Abstract

The shear modulus of solid 4He increases below 200 mK, with the same dependence on temperature, amplitude and 3He concentration as the frequency changes recently seen in torsional oscillator (TO) experiments. These have been interpreted as mass decoupling in a supersolid but the shear modulus behavior has a natural explanation in terms of dislocations. This paper summarizes early ultrasonic and elastic experiments which established the basic properties of dislocations in solid helium. It then describes the results of our experiments on the low temperature shear modulus of solid helium. The modulus changes can be explained in terms of dislocations which are mobile above 200 mK but are pinned by 3He impurities at low temperature. The changes we observe when we anneal or stress our crystals confirm that defects are involved. They also make it clear that the shear modulus measured at the lowest temperatures is the intrinsic value—it is the high temperature modulus which is reduced by defects. By measuring the shear modulus at different frequencies, we show that the amplitude dependence depends on stress in the crystal, rather than reflecting a superfluid-like critical velocity. The shear modulus changes shift to lower temperatures as the frequency decreases, showing that they arise from a crossover in a thermally activated relaxation process rather than from a true phase transition. The activation energy for this process is about 0.7 K but a wide distribution of energies is needed to fit the broad crossover. Although the shear modulus behavior can be explained in terms of dislocations, it is clearly related to the TO behavior. However, we made measurements on hcp 3He which show essentially the same modulus stiffening but there is no corresponding TO anomaly. This implies that the TO frequency changes are not simply due to mechanical stiffening of the oscillator—they only occur in the Bose solid. We conclude by pointing out some of the open questions involving the elastic and TO behavior of solid helium.

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