Abstract
Resistive random access memory (RRAM) devices are considered as one of the most promising candidates for the next generation of high-density non-volatile memories (NVMs). In this work, NiO RRAM devices were fabricated by DC magnetron sputtering. With the changing of the annealing time, different switching properties of RRAM were observed. When the sample annealed for 10min, the device displayed a bipolar switching. On the other hand, a unipolar character behavior of the device was observed when the annealed time increased to 1h. Based on the microstructural analysis, the reason was attributed to the stress. When the annealed time is short, a relative large residual stress remained in the device. It increases the diffusion barrier and traps the ion migration, correlated with a bipolar character behavior of the device. On the contrary, the stress was released when the annealed time increased up to 1h. Then, the device displayed a unipolar switching due to the high diffusion coefficient. This discovery has the potential to reveal the mechanism of switching between unipolar and bipolar of the device and open up new avenues on the research of RRAM.
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