Effects of silver and copper nanoparticles in particleboard to control Trametes versicolor fungus

Abstract

This study looked at commercial particleboard treatment with 200 ppm nanosilver (NS) and nanocopper (NC) suspensions (10–80 nm) to assess the effects on hardness and resistance to the white-rot fungus Trametes versicolor. Suspensions were added to mats at two levels (100 and 150 ml kg−1 dry weight wood particles) and comparison was made with control boards. Both metal nanoparticles had significantly improved resistance to T. versicolor, resulting in decreasing mass loss (ML). Nanocopper was more effective at lower levels. Fungal exposure was associated with reduced hardness in NS-control and NS100 treatments, whereas NS150 produced significant reduction in fungal growth. Copper more effectively protected panels from fungal attack. High significant correlation (85%) was found between ML and hardness values.