Abstract

YMnO 3 thin films deposited on Si (1 0 0) substrate by rf-sputtering were annealed with various conditions. YMnO 3 films annealed in a furnace had a c-axis preferred orientation and the films annealed in a rapid thermal processor (RTP) had random orientations. However, cracks were observed in the highly c-axis oriented YMnO 3 films. YMnO 3 films annealed in the furnace showed poor ferroelectric characteristics. However, YMnO 3 films annealed in the RTP showed a ferroelectric C– V hysteresis with 1.5 V memory window at 0.2 V/s sweep rate. Since the thermal expansion of a-axis is five times higher than that of c-axis in the YMnO 3 thin films, the c-axis oriented thin films are expected to be easily cracked during the post-annealing process. Moreover, the rapid thermal annealing process effectively suppressed the increase of a native SiO 2 thickness in the YMnO 3/Si structure.

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