Effects of ball milling and load on transfer film formation of copper-based composites

Abstract

PurposeThis paper aims to investigate how ball milling (BM) and load influence transfer film on counterbody and the correlation between transfer film and tribological properties of copper-based composites.Design/methodology/approachThe copper-based mixed powders preprocessed by BM for different times were used to manufacture sintered materials. Specimens were tested by a custom pin-on-flat linear reciprocating tribometer and characterized prior and after tests by optical microscope, scanning electron microscope and energy-dispersive spectroscopy. Image J® and Taylor-hobson-6 surface roughness meter were used to quantify the coverage and thickness of the transfer film.FindingsMain results show that an appropriate amount of BM time and applied load can contribute to the formation of the transfer film on counterbody and effectively improve the tribological properties of the copper-based material. The transfer film coverage is linearly related to the friction coefficient, thickness of transfer film and wear volume. As the transfer film coverage increases, the coefficient of friction decreases. As the thickness of the transfer film increases, the amount of wear increases.Originality/valueThis work intends to control and optimize the formation of transfer film, thereby helping improve the tribological properties of materials and providing a reference to guide the preparation of Cu-based composites with excellent tribological properties.