Abstract
Abstract In this work, Mo–Cu composites with improved electrical and thermal conductivities were fabricated by sintering Mo–Cu–Ag powders obtained from a microwave-assisted aqueous solution method, as Ag is added as activator with contents ranging from 0.5 wt.% to 2.0 wt.%. Effects of Ag additive on microstructure, electrical conductivity (EC), thermal conductivity (TC) and coefficient of thermal expansion (CTE) were investigated. Results show that Mo–Cu composites with evenly distributed microstructure can be obtained when the Ag content is 1.5 wt.%. Additionally, Mo–Cu composites with an addition of 1.5 wt.% Ag have the optimal desired properties, 27.82 × 106 Sm−1 for EC and 185.4 W m−1 K−1 for TC, respectively. However, if the Ag addition becomes beyond 1.5 wt.%, it will result in decrease in electrical and thermal conductivities and increase in coefficient of thermal expansion.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.