Effect of Thickness Variation on the Measured Seebeck Coefficient and Power Factor in ITO–NiCr Thin‐Film Thermocouples

Abstract

Herein, the electrical resistivity, Seebeck coefficient, and power factor of an indium tin oxide (ITO) and nickel‐chromium (NiCr) thermocouple are investigated. The thicknesses of the ITO and NiCr are varied between 10 and 430 nm. Seebeck coefficients between 12.8 and (21.4 ± 1.5) μV K−1 are measured, respectively. The results indicate that a reduction in thickness generally leads to an increase in the Seebeck coefficient until a maximum value is reached. Among the measured samples, the optimal Seebeck coefficients are found with an ITO thickness of (111 ± 4) nm and NiCr thickness of (18 ± 2) nm. Finally, the power factor of the thermocouples is determined, with a maximum power factor of (84 ± 7) μW m−1 K−2 for the ITO thickness of (111 ± 4) nm and nickel‐chromium thickness of (42 ± 5) nm.