Abstract

AbstractAlthough they have better electrical and thermal properties, thermal issues have become an important challenge to design modern integrated circuits with single‐walled carbon nanotube (SWCNT) bundle interconnects. The equivalent RLC model for SWCNT bundle interconnect is analyzed. Based on the proposed circuit for single event crosstalk (SEC), the influences of the length of line, nanotube diameter, metallic nanotube ratio, and technology node on SEC at different temperatures are studied. The potential impact mechanisms are also discussed. The simulation results show that, compared with one in copper line, peak voltage and pulse width of SEC in SWCNT interconnect are reduced by an average of 23.7% and 8.8%, respectively. The larger the diameter of SWCNT is or the more the ratio of metallic SWCNT is, the weaker the effect of SEC will be. With the increase of the length of line, the crosstalk effect will increase. The pulse width of SEC is more sensitive to the temperature when the length of line is longer. However, the peak voltage is more sensitive to the temperature when the length of line is shorter. As the technology node shrinks from 21 nm to 9.5 nm, the noise area of SEC increases from 0.55 V•ns to 1.89 V•ns, which results in that the crosstalk action time increases significantly.

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