Abstract

The crosstalk effects in single walled carbon nanotube (SWCNT) bundle and multi-walled carbon-nanotube (MWCNT) interconnect architectures are investigated for global interconnect lengths under sub threshold conditions. The crosstalk induced time delay and the peak crosstalk voltage on victim wire of multi wire SWCNT bundle and MWCNT interconnect configurations are derived and compared to those of the copper (Cu) wire counterparts for the global interconnects for three different technologies (32-, 22- and 16nm). It is observed that, compared with the Cu, and SWCNT bundle the MWCNT interconnect can lead to a reduction of crosstalk-induced time delay and it becomes more significant with increasing interconnect length, while the peak voltage of the crosstalk-induced glitch in MWCNT interconnects is slightly greater than SWCNT bundle and that of Cu wires. Because of considerable improvement in time delay, MWCNT interconnect will be more suitable for the next generation of interconnect technology as compared with the SWCNT bundle and Cu counterpart.

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