Abstract
This paper aims to propose the study of temperature-dependent circuit modeling and performance analysis of SWCNT bundle interconnects. A similar analysis is performed for copper interconnects and a comparison is made between the results of two analyses. The Simulated program with circuit emphasis (SPICE) simulation result revealed that the resistance of both copper and CNT increases with rise in temperature. SWCNT bundle has lower resistance as compared to copper. Simulation result further reveals that the relative delay shows rising trend with rise in temperature at different lengths in both cases. SWCNT bundle shows lower delay then copper due to low resistance and inductance. Relative power also shows the same trend indicating Copper consumes less power than SWCNT bundle interconnects. This is due to the dominance of smaller capacitance of copper.
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