Abstract
In this Paper a comparative analysis between Single-Walled Carbon Nanotube (SWCNT) and Multi-Walled Carbon Nanotube (MWCNT) Bundle interconnects is established. In first place, an Aggressor-Victim model (based on a carbon nanotube equivalent circuit conductor) was carried out to examine the effect of crosstalk and delay in MWCNT bundles. The Aggressor-Victim model was simulated in Pspice taking in consideration tree values of interconnect length: 1, 10 and $50 \mu \mathrm{m}$ . the performance in terms of crosstalk values and the induced delay in MWCNT bundles is simulated on the basis electrical parameters of Carbon Nanotube interconnects for the 32nm technology node at an ambient temperature. A similar analysis is performed for the SWCNT bundle interconnects and compared with MWCNT bundle interconnects.
Published Version
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