Abstract
In this paper, effect of soldering time and temperature on formation of intermetallic compounds developed between Sn–0.3Ag–0.7Cu lead-free solder and copper substrate was investigated. Dip soldering was performed at 250, 270, and 290 °C with soldering time of 5, 10, 15, and 20 s. Either ɛ-Cu 3Sn or η-Cu 6Sn 5 intermetallic phase was found at the interface between the solder and the substrate depending on the soldering condition, i.e., soldering time and soldering temperature. ɛ-Cu 3Sn was found only when the substrate was soldered at 250 °C for 5 and 10 s. At other soldering conditions, only η-Cu 6Sn 5 was found at the interfacial zone. Crystal structure of ɛ-Cu 3Sn intermetallic phase was orthorhombic, and it was hexagonal structure for η-Cu 6Sn 5. Transformation of the intermetallic phases was also discussed.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
