Abstract
Ultrasonic additive manufacturing (UAM) is an advanced additive manufacturing technique that utilizes ultrasonic energy to rapidly joining thin metal tapes into solid parts in a layer accumulating manner. In this study, the effects of processing parameters on the bond properties of UAM samples were investigated via peel tests, linear weld density (LWD) measurements, microhardness tests and EBSD. The results reveal that, in terms of the overall tendency, the peeling strength and LWD increase with the increasing amplitude and normal force settings. However, a parameter threshold phenomenon and two different mechanisms that affect the bond properties were also observed. Furthermore, the microstructure evolution results show that the development of the interface is closely related to the applied parameters, which can also well explain the bond property variations and the parameter threshold phenomenon.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
