Abstract

Ultrasonic consolidation is a novel additive manufacturing process with immense potential for fabrication of complex shaped three-dimensional metallic objects from metal foils. The proportion of bonded area to unbonded area along the layer interface, termed linear weld density (LWD), is perhaps the most important quality attribute of ultrasonically consolidated parts. Part mechanical properties largely depend on LWD and a high level of LWD must be ensured in parts intended for load-bearing structural applications. It is therefore necessary to understand what factors influence LWD or defect formation and devise methods to enhance bond formation during ultrasonic consolidation. The current work examines these issues and proposes strategies to ensure near 100% LWD in ultrasonically consolidated aluminum alloy 3003 parts. The work elucidates the effects of various process parameters on LWD and a qualitative understanding of the effects of process parameters on bond formation during ultrasonic consolidation is presented. The beneficial effects of using elevated substrate temperatures and its implications on overall manufacturing flexibility are discussed. A preliminary understanding of defect morphologies and defect formation is presented, based on which a method (involving surface machining) for minimizing defect incidence during ultrasonic consolidation is proposed and demonstrated. Finally, trade-offs between part quality and build time are discussed.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.