Abstract
Quad Flat No Lead (QFN) is part of an integrated circuit (IC) products that required wire bonding and molding as part of its packaging process. There are many types of QFN packages thickness available in the market and 0.75 mm thickness is one of the highest in demand. The wireless (WLSS) QFN package was used in this research for the mobility of electronics devices especially for wireless technology such as mobile phone and laptop. The objective of this paper is to study the effect of molding cure time at 100 and 130 s of WLSS QFN package. Besides, two variations of package size of 2.5 mm x 2.5 mm and 7.0 mm x 7.0 mm were undergoing each process in QFN packaging stages to adhere to the real manufacturing environment. For characterization, 4 types of QFN package were examined for its moldability through C-CSAM, reliability and electrical test were also carried out according to the Joint Electron Device Engineering Council (JEDEC) requirements. From the result, it was found that the optimum molding cure time is 100 s is suitable for molding the WLSS QFN package. This new curing temperature can be can increase productivity for about 8% for QFN packaging.
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