Abstract
The results of studying the effect of grain-boundary diffusion acceleration during the annealing of submicrocrystalline (SMC) materials prepared by severe plastic deformation techniques are described. It is shown that the grain-boundary diffusion coefficient during recrystallization of SMC materials depends on the density of lattice dislocations and the pattern and rate of migration of the grain boundaries. It is found that, in SMC metals that undergo anomalous grain growth during annealing, the grain-boundary diffusion coefficient increases and its activation energy decreases. In SMC materials in which the recrystallization process exhibits conventional behavior, the diffusion properties of grain boundaries hardly differ from the equilibrium properties. Expressions describing the dependence of the grain-boundary diffusion coefficient on the migration rate of grain boundaries, as well as the thermodynamic and crystallographic parameters of the material, are derived. The calculation results are compared with the experimental data.
Published Version
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