Abstract
In this study, the effect of deposition conditions and the temperature thermal treatment on the oxide parameters of two structures of silicon layers were investigated. The study present the evolution of in situ boron profiles following a dry thermal oxidation in poly-Si/SiO2/c-Si films deposited at 520°C and 605°C temperatures and thermally oxidized in dry oxygen at respectively temperature 840°C, 945°C and 1050°C for duration tr=1h33’. The results show that the deposition conditions and the temperature treatment make a very important impact on the obtained films, which affect the redistribution and localization of dopants. It has been observed that the obtained value of the linear and the parabolic rate constant, the diffusion coefficient and the oxidation thickness are higher in the films deposited at Td = 520°C than those deposited at Td = 605°C. Also, the X-ray diffraction is strongly affected by the oxide thickness deposited between poly-silicon layers and crystalline substrates.
Highlights
Thermal oxidation enables the formation of thin, almost defect-free, and reliable silicon oxide films (Gerlach and Maser, 2016)
The effect of the deposition parameters of poly-silicon films obtained by LPCVD method, with 200 nm of thickness and doped with in situ boron (2×1020cm-3), has been studied as function of the characteristics parameters of thermal oxidation such as the linear and the parabolic rate constant for a thermal treatment ranging from 840°C, 945°C and 1050°C, for duration of 1h33’
The linear rate constant is dominated by the reaction at the SiO2/Si interface
Summary
Thermal oxidation enables the formation of thin, almost defect-free, and reliable silicon oxide films (Gerlach and Maser, 2016). This is the reason for the dominance of silicon in semiconductor industry in comparison to other materials (Lojek, 2005). The oxidation of silicon is based on the migration of oxidation species through the already formed silicon oxide layer and following interfacial reactions, described by two parameters, the linear and the parabolic rate constant, respectively (Fukuda, 1997), (Hashim, et al, 2015), (Kovacevic, Pivac, 2014) These parameters are closely related to the deposition conditions and the initial surface texture of the films
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