Abstract
Electrostatic discharge (ESD) testing results of aluminum (Al) and copper (Cu) interconnect wires and vias for advanced semiconductor technologies demonstrate that interconnects will be a limiting failure mechanism in the future for ESD robustness of semiconductor chips. Comparison of Cu and Al interconnect and vias ESD robustness and failure mechanisms will be shown. Results demonstrate an improvement in the ESD robustness of a Cu-based interconnect system, compared to Al-based interconnects, with an improvement in the critical current density, J/sub crit/, in the human body and machine model time regimes.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
More From: IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.