Dual metal core multilayer boards (MLBS) – a better option for high speed spacecraft electronic packaging applications

Abstract

PurposeRealising a solution for effective thermal management for high‐speed electronic packaging for spacecraft applications through dual metal core MLBs.Design/methodology/approachHighlights fabrication issues and describes corrective actions.FindingsDual metal core MLBs can solve heat dissipation as well as CTE issues in high‐speed electronic packaging for spacecraft applications. Optimisation of the processes were done to sort out various problems encountered in the fabrication stages.Originality/valueThe paper projects the advantages of dual metal core MLBs over traditional heat sinks and centralized single metal core MLBs. It also helps in simplifying the fabrication processes to avoid the various bottlenecks observed.