Abstract
A UV laser can machine a wide variety of circuit board materials and the UV laser beam can be finely focused to generate very small features. These unique capabilities in combination enable the UV laser technology to provide a variety of efficient solutions for electronic interconnect and packaging applications that are driven by increased high density and high speed signaling requirements. Several 355nm UV laser based micromachining solutions for these applications developed by Electro Scientific Industries Inc. are presented here to highlight the growing demands for the UV laser technology and the rewarding benefits to the electronic interconnect and packaging applications
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