Novel organic–inorganic composites with high thermal conductivity for electronic packaging applications: A key issue review

Abstract

Significant progress has been made recently in developing the organic–inorganic composites with high thermal conductivity, low dielectric constant, and dielectric loss, for applications in the electronic packaging and substrates. Many studies have shown that some polymers filled with high thermal conductivity and low dielectric loss ceramics are suitable for electronic packaging for device encapsulation. Until now, extensive attentions have been paid to the preparation of polymeric composites with high thermal conductivity and low dielectric loss for the application in electronic packaging. In contrast, the thermal conductivities of these dielectric materials are still not high enough and that might restrict their serviceable range. Herein, we briefly reviewed recent progress in this field and introduced a kind of novel composites with surface insulation modified metal aluminum cores to form multilayer coating structures as fillers in polyimide matrix for electronic applications. This structure can significantly improve the thermal conductivity and dielectric properties of composites and give some insights into the effects of modified fillers of composite materials. Such multilayer core–shell structures should have great potentials for the improvement of nanoparticle‐based fillers and applications of electronic packaging. POLYM. COMPOS., 38:803–813, 2017. © 2015 Society of Plastics Engineers