Abstract
AbstractThe Sn‐3.5Ag‐0.5Cu (SAC305) solder alloy is a prominent candidate for the Pb‐free solder, and SAC305 solder is generally employed in today's electronic enterprise. In this study, the formation of intermetallic compounds (Cu6Sn5 and Ag3Sn) in the solder (bulk area), average neighboring particle distance, and the morphological mosaic are examined by the addition of silicon carbide (SiC) and nickel‐coated SiC reinforcements within Sn‐3.5Ag‐0.5Cu solder. Results reveal that the addition of SiC and SiC(Ni) particles is associated with a small change to the average neighboring particle distance and a decrease in clustering rate to a certain limit of the Sn‐3.5Ag‐0.5Cu solder composites. Moreover, the development of the Cu6Sn5 and the structure of the Ag3Sn are improved with the addition of SiC and Ni‐coated SiC.
Highlights
Lead-free solder composites, fabrications that combine solder matrices and ceramic reinforcement, for example, silicon carbide (SiC), TiO2, Al2O3, and Si3N4, have been progressively changed to be used for important structural electronic packaging for commercial industrial applications
The average size of Ag3Sn and Cu6Sn5 intermetallic compounds (IMC) particles were identified as 1-2.5 μm and 2–4 μm in the SAC305-SiC lead-free composite solder
The microstructure consists of intermetallic compounds (IMCs) as shown by the arrow in Fig. 2b and c, which is scattered inside the Sn rich matrix
Summary
Lead-free solder composites, fabrications that combine solder matrices and ceramic reinforcement, for example, SiC, TiO2, Al2O3, and Si3N4, have been progressively changed to be used for important structural electronic packaging for commercial industrial applications. It can be a favorable technique for producing various lead-free alloys were such where such problems often occur. Sarkar et al [18] and Zhou et al [19] proposed object filtering methods to moderate partially distinguished objects utilizing morphological highlights and they evaluate the estimations utilizing physically clarified particle masks The purpose of this investigation is to develop the SiC and SiC(Ni) reinforced Sn-3.0Ag-0.5Cu lead-free solder based composites using powder metallurgy technique to examine the microstructure, average neighbour’s particle distance and morphological mosaic by the image analysis technique
Sign-in/Register to view highlights & summary Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
